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Hi, Sean Please provide below data. 1. 10M chamber test result 2. BT performance comparison test(with/without shield CAN) 3. Thermal test result 4. Material cost(Shield CAN(top and bottom) and finger(9ea)): We should revise KC, so we shall compare test fee and material cost) 5. Other change lists(Example, TIM, etc) Best regards Lonnie Kim |
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Hi Mr. Kim, We are contacting with lab and will quote to biz team. If all test result pass and can remove shielding, is there any test or item should ALT or SKB do?(like update doc to KC, BMT test, OTA test..) Please give us rough schedule, thank you very much. BR, Eva Sun |
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Hi, Eva We can talk with SKB if there any issue on test report. And, shcedule may need to much time for change because removing shield can is not easy. Best regards Lonnie Kim |
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Hi Lonnie attached is 10M chamber test result(Horizonal over 0.21db) and BT performance comparison test BR Cooper |
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Hi Lonnie, Should we continue to debug 10M EMI? (It seems to be related to HDMI CABLE or lab environment) or directly test in Korea? Cooper |
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Hi Cooper . It will be EMI test in 10 chambers in Korea this week. Decide on details after got results Best regards jung |
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Hi Copper. Attached is 10M chamber test result( Vertical over 1.1 db) Best regards jung |
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Hi Sun Choul, The frequency of failure doesn't seem to come from DUT, our suggestion is to replace the screen. Hi Lonnie, attached is thermal & reliability test report(2 vendors from thermal pad). and the result is pass(thermal test will be pass after replace thermal pad from K=5W to K=3W) BR. Cooper |
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Hi, Cooper Kung Please follow-up below items 1. Datasheet. 1) Current thermal pad datasheet 2) New thermal pad datasheet - Shiuli -Tianmai 2. BT test 1. Interference with USB3.0(below test shall implement when USB3.0 port data transfer) - Sensitivity test(with & without shield can) - Antenna performance(with & without shield can) 3. Thermal test - Please provide test result with shield CAN - Top and bottom case shall within 40'C when 25'C ambient temperature, (You test result can not meet bottom case) Best regards Lonnie Kim |
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Hi Lonnie, 1. Datasheet. 1) Current thermal pad datasheet 2) New thermal pad datasheet - Shiuli -Tianmai =>as below attacheds, FYI 2. BT test 1. Interference with USB3.0(below test shall implement when USB3.0 port data transfer) - Sensitivity test(with & without shield can) =>as below attached, FYI - Antenna performance(with & without shield can) =>Foxconn ANT performance test is passive mode and without power in and USB3.0 and BT will not interfere by our experience. Can we waive USB3.0 port data transfer and do ANT perofrmance test just with/without Shild can on passive mode? 3. Thermal test - Please provide test result with shield CAN => as below attached - Top and bottom case shall within 40'C when 25'C ambient temperature, (You test result can not meet bottom case) =>previously we waive bottom housing in thermal test report as attached BR Cooper |
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Hi, Cooper Kung About thermal test, I know bottom was waived. I want to know how many temperature has gap with and without shield CAN. Could you provide latest thermal test result with shield CAN? Best regards Lonnie Kim |
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Hi Lonnie, Latest thermal test with shield CAN bottom: 34.21°C, FYI. without Shield CAN bottom: 41.6°C(worst) Cooper |
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Hi, Cooper Kung Old thermal pad's thermal conductivity is 5.0W/m.K. But, new ones are 3.2W/m.K and 3.0W/m.K. I think you should use same or similar thermal conductivity one. Best regards Lonnie Kim |
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Hi Lonnie, Previously,5W thermal pad test result is over 0.1°C on TOP housing(40.1°C) so we replace thermal pad from 5W to 3W then top housing will be pass. In FXN thermal team and part number system, thermal conductivity 3.2W and 3W can be under the same part number Best regards Cooper 5W Fail 0.1C.PNG (85,805 bytes) |
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Hi, Cooper Kung I don't remember using 3W thermal pad. Please use 5W or similar one. Best regards Lonnie Kim |
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Hi Lonnie, Please see the attached, Best regards Cooper Thermal Test Comparison Table.PNG (42,904 bytes) |
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Hi, Cooper Kung I can't understand what you say about attached file. I think you can use case2~4 thermal pad. Best regards Lonnie Kim |
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Hi Lonnie, I list a new comparison table between 3W/5W thermal pad and with/without shield CAN, as attached The reason for needing to replace from 5W to 3W thermal pad is 5W over 0.1°C on Top housing(without Shield CAN) Best regards Cooper |
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Hi Mr.Yoon and Lonnie, Are there any update on EMI test result? Based on our discussion at last week's meeting, ALT will be testing EMI without a shielding cover on Friday. Thanks, Regards, Sean |
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Hi Sean The smart3 without shield can is EMI Test result of 1,2dBm margin . Similar data before and after removing the shield can. Attached is 10M chamber test result, Best Regards joung |
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Hi, Sean As I commented on Wechat, I think there are some gap of performance with 2 vendor, and case temperature arrived at threshold. So, I think it will be difficult to use 2 vendor. Best regards Lonnie Kim |
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Hi Joung & Lonnie May I ask what the difference between previous conditions & current conditions? we think 1,2dBm is acceptable, is this result acceptable to ALT? about thermal pad, we will find another vendor to provide sample for thermal test. Best regards. Cooper |
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Hi Lonnie, attached is Antenna performance(with & without shield can) report, Best regards Cooper |
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Hi Lonnie, Attached is thermal test comparison table and datasheets, we add HFC/3W thermal pad test result in xlsx file. also we will do thermal test for W=1.5K between Vendor HFC and TIANMAI Best regards Cooper |
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Hi Lonnie, Attached is W=1.5K thermal test report and comparison table from vendor HFC & TIANMAI, let us know if you agree with W=1.5K test results, Best regards Cooper |
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Hi, Cooper Kung I reviewed yout test report. I understood case temperature using 1.5W/K thermal pad. But, I don't understand SoC temperature why 1.5W/K lower than 5W/K? Best regards Lonnie Kim |
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Hi Lonnie, As recommended by thermal team, there are many factors that may affect, assembly, thermocouple error or time to capture temperature. Best regards |
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Hi Lonnie, add setup pictures on sheet3 Best regards Cooper |
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Hi, Cooper Kung I know there are so many factor, so it sholud be careful to measure SoC with TIM. Normally, SoC's temperature uses reading internal junction temperature. I remembered we used reading internal junction temperature at SWAN because that time has similar issue. Best regards |
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Hi Lonnie, Yes, you are right. We think the problem may be caused by the thermal coupler is not well fixed on SoC by using glue, and it did happen in our QA team before. However, may I know if you will send the 5W result to SKB? If it's just a reference, shall we just provide 1.5W & 3W thermal pad test result to SKB? So that we don't need to suck more resources at this point since we know that the 5W test result of surface temperature is not good than 3W & 1.5W. Thanks, Regards, Sean |
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Hi, Sean For submitting to SKB, please fill in yellow sction. There should include size & vendor. Best regards Lonnie Kim Removing shield can for Smart3.png (19,136 bytes) |
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Hi Lonnie, FYI Best regards Cooper Removing shield can for Smart3-2.PNG (33,903 bytes) |
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Hi, Cooper Kung Thank you for your fast feedback. Best regards Lonnie Kim |
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Hi, Cooper Kung Could you provide reliability test report using 1.5W thermal pad? You shall provide 2 reports using HFC and Tianmail. Best regards Lonnie Kim |
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Hi, Cooper Kung Please provide below items. 1. 1.5W thermal pad mechanical diagram 2. 1.5W thermal pad electrical spec.(HFC) Best regards Lonnie Kim |
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Hi, Cooper Kung About Electrical spec, please provide English version satasheet included Tianmai. Best regards Lonnie Kim |
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Hi Lonnie, Could you provide reliability test report using 1.5W thermal pad? You shall provide 2 reports using HFC and Tianmail. =>In reliability test without shielding cover, we use assembly test so new thermal pad have to be added. actually, thermal pad implement is no necessary to do reliability test, only do thermal test is ok by HWQA. 1. 1.5W thermal pad mechanical diagram 2. 1.5W thermal pad electrical spec.(HFC) 3. About Electrical spec, please provide English version satasheet included Tianmai. =>attached is datasheet with electrical spec & mechanical diagram(TMA-1510 Page2) Best regards Cooper |
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Hi Lonnie, add HFC mechanical diagram report, Best regards Cooepr |
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Hi, Cooper Kung My means mechnical diagram that included size and thickness in this model. Best regards Lonnie Kim |
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Hi Lonnie, Please see the 0001499:0010670 attached 1, I have provided before, HFC and TIANMAI will follow this size in this model. Best regards Cooper |
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Hi, Cooper Kung Your diagram is 5W thermal pad(please see electrical spec.) Please provide mechanical diagram for 1.5W thermal pad. Best regards Lonnie Kim |
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Hi Lonnie, attached is 1.5W thermal pad mechanical diagram Best regards Cooper |
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Hi Mr.Yoon, The following are reliability test items before https://mantis.cnsbg.foxconn.com/vaas/view.php?id=1499#c10625 Best regards Cooper Reliability test items.PNG (81,230 bytes) |
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Hi, Cooper Kung Please refer to below reliability test item - High temerature and Humidity - Low Temperature and Humidity - Temperature & Humidity cycle test - Remove salt spray test Best regards Lonnie Kim |
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Hi Lonnie, Attached is reliability test report for HFC & TIANMAI 1.5W thermal pad Best regards Cooper |
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Hi Sean, Please update the drawing for T99x171.00 final assembly diagram. - Heat spreader thermal pad update : contact to SoC and Top case - Remove the shielding cover : Top and Bottom - Remove the Chip thermal pad this is requested from SKB, please update asap. Thanks SON image.png (93,848 bytes) |
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Hi SH, OK. We will prepare it and send it to you soon. Hi Cooper, Please work with ME engineer and prepare final assembly drawing of Eagle to SH soon. Thanks. Regards, Sean |
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Hi SH Please refer attached for final assembly diagram from our ME engineer Regards Cooper |
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Hi Lonnie, Attached is comparison table of versions used in r13 dvt1 and thermal pad tests, Regards Cooper |
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Hi Mr. Cooper Kung, Could you add test condition ? Did you play 4K Youtube and iperf test ? Best Regards, SuhYoung YOON |
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Hi SY, OK, please see attached Condition: play 4K video on local and iperf 50Mbps Regards Cooper |
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Hi Mr. Cooper Kung, Could you provide test image ? We will check with your SW that you used for test. Our engineer think that the error cause server connection issue. Best Regards S YOON |
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Hi SY, Here is r13 dvt1 (15.502.13) image link https://drive.google.com/file/d/1RVL-z53myPbXWknuy9KDweLcFAWfF_i8/view?usp=share_link Regards Cooper image-2.png (914 bytes) |
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Hi Mr. Cooper Kung, We checked your test condition in our office. We attached test result in our office. We think that you don't have dns error when you use VPN. Could you ask to help to set VPN for your test ? After set, please check the load again. If CPU load may reduce after VPN set, then please use this environment for your thermal test. Best Regards, SuhYoung YOON |
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Hi Yoon, If we need to use factory account to change Mac for log in Please add this Mac: 28:CD:C4:FD:4B:86 in ALT Mac list So that we can use the same test conditions as yours Regards Cooper |
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Hi Cooper Kung, I added 28:cd:c4:fd:4b:86 Mac address on SKB system just before. If you have any problem to use, please let me know. BR S Yoon |
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Hi Yoon Sorry for wrong Mac: 28:CD:C4:FD:4B:86 Can you provide below photo Mac again? Correct: 28:cd:c4:fd:4b:75 Thanks Cooper 188503.jpg (52,131 bytes) 188502.jpg (73,821 bytes) 188501.jpg (64,014 bytes) |
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Hi Cooper Kung, Please be caful to handle Mac Address. We should set these Mac address in SKB system. I set it again. BR S YOON |
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Hi Lonnie, Attached is thermal test comparison table with INTEK, new thermal pad and original thermal pad Regards Cooper |
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Hi SY, Attached is CPU Loading by ALT condition after logging a. 4KP60 on youtube b. iperf But the result is also CPU loading 90% Regards Cooper |
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Hi Mr. Cooper Kung, I have question about your test. 1. Did you test CPU load with DVT Test SW after VPN Set ? And I asked to check with SW version 15.502.39 during Year End worshop last week. Did you tested it ? 2. The temperature of INTEK housing and SoC is lower than ours. What is the reason that INTEK's STB is the lower than ours. Best Regards, SuhYoung YOON |
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Hi SY, 1.a. Yes, I connect to VPN and measure CPU loading by 15.502.13 version. 1.b. we don't have 15.502.39, we just have 15.502.33(MP on 2019/06) and 15.502.43(MP on 2019/08) we recommand to use 15.502.43 because it is suitable for your needs, or you can porivde 15.502.39 version to us 2. We discuss with our thermal team now, will update to you after discusstion. Regards Cooper |
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Hi Mr. Cooper Kung, You can use SW v 15.502.43. It may stable than 15.502.13 and 15.502.39. And let us know your test result. Best Regards, SuhYoung YOON |
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Hi SY, After burning, we found that 15.502.43 is user build and without SD, So I can't use the same test condition to run iperf, Then we confirm a HDMI certified version(15.513.10)(2020.03.17) which can run iperf and there is no error message on logcat That us know if you agree to use 15.513.10 to test cpu loading. Regards Cooper |
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Hi Mr. Cooper Kung, I uploaded 15.502.43 SD File. The link is https://drive.google.com/file/d/1UGRcXpPm5z8aNmJZIjBUALvMbAEuvi-4/view?usp=sharing Could you check it ? Best Regards, SuhYoung YOON |
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Hi SY, Attached is 15.502.43 CPU Loading report, Regards Cooper |
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Hi SY, as above 0001499:0011548 2. We discuss with our thermal team now, will update to you after discusstion. => Summary as below: a. Intek heatspreader punch type is better than us because of 360 degree expandly(attached.jpg) b. Intek heatspeader area is larger than us(attached .jpg) c. Under similar software version, Intek CPU loading is higher than us but thermal is better so the reason is Intek have better heatspreader(attached .png) Regards Cooper INTEK cpu lading comparision.png (56,372 bytes) |
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Hi, Sean I think your heatspreader and intek's heatspreader were similar size. As your opinion, Intek's top case temperature would be higher than yours because intek's heatspreader more higher thermal conduction. But, intek's top case lower than yours. Could you explain? Best regards Lonnie Kim |
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Hi Mr. Cooper Kung and Mr. Sean Chiang, Could you check the Thermal test with 15.502.43 or higher, but it shouc be 15.502.xx. If you can check it with SW version 15.502.43, then it will be helpful to discuss with SKB. Best Regards, SuhYoung YOON |
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Hi SY, Re-test thermal will be arranged on 1/30 by our QA because before new year. and PM hope next week will confirm the solution because of shielding stock will no longer prepare. 15.502.43 CPU loading is similar with 15.520.08(attached png.) so you can use 15.520.08 thermal test report(attached pdf) to explain to SKB because of almost the same CPU loading Regards Cooper |
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Hi Lonnie, I update the IR photos of Intek DUT on attached The results show that Intek heat dissipation is more uniform distribution than us (Intek: punch type 360 degree and Ethernet port touch heatspreader) Therefore. Intek can get a lower housing temp. than us Regards Cooper |
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SKB decided to keep using Shield CAN. |
- yk.jung ( (ALTech) Younkwang Jung ) developer
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